Ascend D2 HW-03E
@Huawei
SmartPhone 2 GB RAM, 32 GB max storage, K3V2 / Cortex-A9 chipset, 2150 mAh battery, 13 MP primary camera, 1 MP front camera, screen TFT 4.7" 720x1280, Android, 3.5mm Jack / MHL / Micro-USB, released on 4/2013
| Property | Value |
|---|---|
| Device Type | SmartPhone |
| Native Platform | Android |
| Hardware Vendor | Huawei |
| OEM | Huawei |
| Hardware Name | Ascend D2 |
| Release Year | 2013 |
| Release Month | 4 |
| Popularity | 132 |
| Device RAM | 2 GB |
| Battery Capacity | 2150 mAh |
| Has Removable Battery | true |
| Max Internal Storage | 32 GB |
| Expansion Slot Type | MicroSD |
| Expansion Slot Max Size | 32 GB |
| Supported I/O | 3.5mm Jack, MHL, Micro-USB |
| Supported Charger Types | Wire |
| Supported Bearers | Bluetooth, EDGE, GPRS, GSM, HSDPA, HSUPA, LTE, SMS, UMTS, WCDMA, WiFi |
| Has NFC | true |
| Screen Type | TFT |
| Screen Inches Diagonal | 4.7 inch |
| Screen Pixels Width | 720 pixels |
| Screen Pixels Height | 1280 pixels |
| Bits Per Pixel | 24 |
| Camera Types | BackFacing, FrontFacing |
| Back Camera Mega Pixels | 13.1 megapixels |
| Front Camera Mega Pixels | 1.0 megapixels |
| Supported Camera Features | Autofocus, CMOS Sensor, Face Detection, HDR, LED Flash, Optical Zoom, Smile Detection |
| SoC Designer | HiSilicon |
| SoC | K3V2 |
| SoC Model | K3V2 |
| CPU Designer | ARM Holdings plc |
| CPU | Cortex-A9 |
| CPU Cores | 4 |
| CPU Maximum Frequency | 1.5 GHz |
| GPU Designer | Vivante |
| GPU | GC4000 |
| Supported SIM Card Types | Mini |
| Max Number Of SIM Cards | 1 |
| Screen Inches Square | 9 inch |
| Screen Inches Width | 2.3 inch |
| Screen Inches Height | 4.1 inch |
| Supported Bluetooth Version | 4.0 |
| Satellite Navigation Types | A-GPS, GLONASS, GPS, S-GPS |
| Supported Sensor Types | Accelerometer, Magnetometer |