Le Pro 3 AI LEX6500
@LeTV
SmartPhone 4 GB RAM, 64 GB max storage, Helio X27 / Cortex-A72+Cortex-A53 chipset, 4000 mAh battery, 13 MP primary camera, 8 MP front camera, screen IPS 5.5" 1080x1920, weight 168 g, 3.5mm Jack / USB Type-C, released on 1/2018
| Property | Value |
|---|---|
| Device Type | SmartPhone |
| Hardware Vendor | LeTV |
| OEM | LeTV |
| Hardware Name | Le Pro 3 AI |
| Release Year | 2018 |
| Release Month | 1 |
| Popularity | 239 |
| Device RAM | 4 GB |
| Battery Capacity | 4000 mAh |
| Has Removable Battery | true |
| Weight With Battery | 168 grams |
| Max Internal Storage | 64 GB |
| Supported I/O | 3.5mm Jack, USB Type-C |
| Supported Charger Types | QuickCharging, Wire |
| Supported Bearers | Bluetooth, CDMA2000, EDGE, EVDO, FDD-LTE, GPRS, GSM, LTE, SMS, TD-LTE, TD-SCDMA, UMTS, WCDMA, WiFi |
| Has NFC | true |
| Screen Type | IPS |
| Screen Inches Diagonal | 5.5 inch |
| Screen Pixels Width | 1080 pixels |
| Screen Pixels Height | 1920 pixels |
| Bits Per Pixel | 18 |
| Camera Types | BackFacing, FrontFacing, SecondBackFacing |
| Back Camera Mega Pixels | 13.0 megapixels |
| Front Camera Mega Pixels | 8.0 megapixels |
| Supported Camera Features | CMOS Sensor, HDR, LED Flash, PDAF, Panoramic Shot, Touch Focus |
| SoC Designer | MediaTek Inc. |
| SoC | Helio X27 |
| SoC Model | MT6797X |
| CPU Designer | ARM Holdings plc |
| CPU | Cortex-A72+Cortex-A53 |
| CPU Cores | 10 |
| CPU Maximum Frequency | 2.6 GHz |
| GPU Designer | ARM Holdings plc |
| GPU | Mali-T880 MP4 |
| Supported SIM Card Types | Nano |
| Max Number Of SIM Cards | 2 |
| Screen Inches Square | 13 inch |
| Screen Inches Width | 2.7 inch |
| Screen Inches Height | 4.79 inch |
| Supported Bluetooth Version | 4.2 |
| Satellite Navigation Types | A-GPS, BeiDou, GLONASS, GPS |
| Supported Sensor Types | Ambient Light, Digital Compass, Fingerprint, Gravity, Gyroscope, Magnetometer, Proximity |