Tough 5 T57 Telstra
@ZTE
SmartPhone 1 GB RAM, 8 GB max storage, Snapdragon 210 / Cortex-A7 chipset, 3200 mAh battery, 8 MP primary camera, 2 MP front camera, screen TFT 2.8" 320x480, weight 180 g, IP67, Android, 3.5mm Jack / Micro-USB, released on 4/2018
| Property | Value |
|---|---|
| Device Type | SmartPhone |
| Native Platform | Android |
| Hardware Vendor | ZTE |
| OEM | ZTE |
| Hardware Name | Tough 5 |
| Release Year | 2018 |
| Release Month | 4 |
| Price Band | 200.00 - 249.99$ |
| Popularity | 92 |
| Device RAM | 1 GB |
| Battery Capacity | 3200 mAh |
| Has Removable Battery | true |
| Weight With Battery | 180 grams |
| Max Internal Storage | 8 GB |
| Expansion Slot Type | MicroSD |
| Expansion Slot Max Size | 128 GB |
| Durability | IP67 |
| Supported I/O | 3.5mm Jack, Micro-USB |
| Supported Charger Types | Wire |
| Supported Bearers | Bluetooth, EDGE, GPRS, GSM, HSDPA, HSPA, HSPA+, HSUPA, LTE, SMS, UMTS, WCDMA, WiFi |
| Has NFC | true |
| Screen Type | TFT |
| Screen Inches Diagonal | 2.8 inch |
| Screen Pixels Width | 320 pixels |
| Screen Pixels Height | 480 pixels |
| Bits Per Pixel | 24 |
| Camera Types | BackFacing, FrontFacing |
| Back Camera Mega Pixels | 8.0 megapixels |
| Front Camera Mega Pixels | 2.0 megapixels |
| Supported Camera Features | CMOS Sensor, Geo Tagging, HDR, LED Flash, Panoramic Shot |
| SoC Designer | Qualcomm Incorporated |
| SoC | Snapdragon 210 |
| SoC Model | MSM8909 |
| CPU Designer | ARM Holdings plc |
| CPU | Cortex-A7 |
| CPU Cores | 4 |
| CPU Maximum Frequency | 1.2 GHz |
| GPU Designer | Qualcomm Incorporated |
| GPU | Adreno 304 |
| Supported SIM Card Types | Micro |
| Max Number Of SIM Cards | 1 |
| Screen Inches Square | 4 inch |
| Screen Inches Width | 1.55 inch |
| Screen Inches Height | 2.33 inch |
| Max Talk Time | 780 minutes |
| Max Standby Time | 400 hours |
| Supported Bluetooth Version | 4.1+EDR |
| Satellite Navigation Types | GPS |
| Supported Sensor Types | Accelerometer |